AMD hit with patent lawsuit over hybrid bonding used in its 3D V-Cache processors
NegativeArtificial Intelligence
AMD hit with patent lawsuit over hybrid bonding used in its 3D V-Cache processors
AMD is facing a patent lawsuit from Adeia over its 3D V-Cache processors, which allegedly utilize hybrid bonding technology without proper licensing. This legal challenge could impact AMD's production and sales, raising concerns about the future of its innovative chip designs. As the semiconductor industry continues to evolve, such disputes highlight the importance of intellectual property rights and the potential consequences for companies that may inadvertently infringe on patents.
— via World Pulse Now AI Editorial System




