Applied Materials, BESI Push Die-to-Wafer Hybrid Bonding Toward High-Volume Manufacturing
PositiveArtificial Intelligence
- Applied Materials and BESI have launched the Kinex hybrid bonding system, which is set to revolutionize die-to-wafer bonding for advanced chiplet packaging. This development signifies a major step forward in semiconductor manufacturing technology.
- The introduction of the Kinex system is crucial for Applied Materials and BESI as it positions them to meet the increasing demand for efficient and scalable semiconductor packaging solutions in a competitive market.
- This advancement aligns with broader trends in the semiconductor industry, where companies are continuously innovating to improve thermal management and efficiency, as seen with recent developments in cooling packages for SiC MOSFETs and Schottky barrier diodes.
— via World Pulse Now AI Editorial System
