First monolithic 3D chip built in U.S. foundry delivers major AI speed gains
PositiveArtificial Intelligence

- A collaborative team has successfully developed the first monolithic 3D chip in a U.S. foundry, achieving significant advancements in chip wiring density and speed for artificial intelligence (AI) applications. This innovation marks a pivotal moment in semiconductor technology, enhancing the capabilities of AI systems.
- The introduction of this 3D chip is crucial for the U.S. foundry as it positions the facility at the forefront of AI hardware development, potentially attracting further investment and partnerships in the rapidly evolving tech landscape.
- This development reflects a broader trend in the semiconductor industry, where innovations such as thin-film materials and virtual twin technologies are being explored to improve chip performance and energy efficiency, addressing the growing demands of AI and connected devices.
— via World Pulse Now AI Editorial System





