The Ultimate 3D Integration Would Cook Future GPUs
NeutralTechnology

- AMD and Nvidia are exploring advanced 3D integration techniques that could revolutionize GPU architecture by stacking high-bandwidth memory (HBM) directly on top of the GPU, potentially addressing significant energy and latency issues in AI computing. This innovation is being studied by Imec, which highlights both the promise and challenges of such technology.
- The development is crucial for AMD and Nvidia as they strive to enhance the performance of their AI products, positioning themselves at the forefront of a rapidly evolving market where efficiency and speed are paramount.
- This advancement reflects a broader trend in the tech industry towards integrating memory and processing units to overcome existing bottlenecks, while also highlighting the competitive landscape where companies like Nvidia are launching new AI models, such as Nemotron 3, to maintain their leadership in AI infrastructure.
— via World Pulse Now AI Editorial System




