Today’s Complex Chipsets Require New Metrology Approaches

EE TimesTuesday, December 9, 2025 at 4:24:39 PM
Today’s Complex Chipsets Require New Metrology Approaches
  • The increasing complexity of chip designs is leading to damage on wafers and a reduction in chip yield, necessitating new metrology approaches such as Wavefront Phase Imaging for precise wafer measurements and improved process control.
  • This development is crucial for semiconductor manufacturers as it addresses the challenges posed by intricate chip designs, ultimately aiming to enhance production efficiency and yield rates, which are vital for maintaining competitiveness in the fast
  • The shift towards advanced metrology techniques reflects broader trends in semiconductor design and manufacturing, including the need for effective thermal management in multidie configurations and the integration of innovative technologies like hybrid bonding systems, which are essential for high
— via World Pulse Now AI Editorial System

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